Physical vapor deposition is a widely utilized technology for thin films and surface coatings fabrication. The technological developments in nanoscience have resulted in the wide usage of this technology for the fabrication of layers with desired microstructure and properties.

Physical vapor deposition is a process that involves the transfer of material from the condensed phase to the vapor phase, and then back to the thin film condensed phase. Evaporation and sputtering are widely used processes of physical vapor deposition.

The physical vapor deposition involves sputtering or evaporation of different components for vapor phase production, supersaturation of the vapor phase in an inert atmosphere to facilitate metal nanoparticles' condensation, and nanocomposite consolidation by thermal treatment.

Browse detailed report - Physical Vapor Deposition Market Analysis and Demand Forecast Report

The sputter deposition facilitates the high-quality epitaxial superlattices and thin films of complex oxides at an extremely low cost compared to others. It also facilitates the high quality of oxide films led by the interest in a specific class of complex oxide materials and results in scientific progress.

Sputter deposition is highly preferred for thin film applications where density, purity, and stoichiometry hold a prominent position for the functionality of the films. The evolutionary advances and refinements that facilitate sputter deposition tooling and processes for rough cadence continue proceeding with semiconductor industry technology nodes.

Therefore, the scientific progress led by the decline in cost of high quality oxide films facilitated by the sputter deposition boosts the industry.